Investigation of Thermo-mechanical Stress in Modern Interconnect Layouts
نویسندگان
چکیده
We present a combination of transient electro-thermal simulations of three-dimensional interconnect structures and the calculation of their coupled intrinsic thermo-mechanical stress distributions. For the numerical solution of the electro-thermal as well as the thermo-mechanical stress problem, we apply the finite element method. A practical example is presented where the temperature and the pressure distribution at different times have been investigated.
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